SENLIAN delivers advanced HDI solutions that solve complex design challenges – enabling superior signal integrity, reduced layer counts, and enhanced reliability through precision microvias, fine-line tracing, and stacked structures. We help you accelerate innovation in next-generation applications, from medical devices
to high-speed networking, ensuring your product leads the market without compromise.
| Stack-up | 8 layers, 2LAM Buried, 1 sequential HDI |  |
| Final Thickness | 1.7±0.17mm | |
| Plating Aspect Ratio | 5.26:1 | |
| Minimum Hole Size | 0.3mm | |
| Minimum line width/line spacing | 3.94/3.7mil | |
| Surface Finish | ENIG | |
| Inner Layer Copper Thickness | 0.74:1 | |
| Business Segment | Industrial |
| Stack-up | 12L 3LAM Buried 2 sequential HDI |  |
| Final Thickness | 1.57±0.157mm | |
| Plating Aspect Ratio | 6.12:1 | |
| Minimum Hole Size | 0.25mm | |
| Minimum Hole Size | 3.23/4.1mil | |
| Surface Finish | ENIG + OSP | |
| Blind Via Aspect Ratio | 0.7:1 | |
| Business Segment | Industrial |
| Stack-up | 4L 1LAM Buried HDI |  |
| Final Thickness | 1.6±0.16mm | |
| Plating Aspect Ratio | 6:1 | |
| Minimum Hole Size | 0.25 | |
| Minimum line width/line spacing | 3.0/7.78mil | |
| Surface Finish | ENIG | |
| Blind Via Aspect Ratio | 0.6:1 | |
| Business Segment | Automotive – LED light |
| Stack-up | 16L 2LAM 1 buried HDI |  |
| Final Thickness | 2.77±0.22mm | |
| Plating Aspect Ratio | 6.9:1 | |
| Minimum Hole Size | 0.4mm | |
| Minimum line width/line spacing | 5.9/7.87mil | |
| Surface Finish | ENIG | |
| Inner Layer Copper Thickness | 3oz（Total Copper Thickness 42oz） | |
| Business Segment | AI Server Power Supply |
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