PCB Manufacturing Capabilities

Use this page to quickly verify feasibility for your build. The ranges below are typical capability references. Final capability is confirmed by engineering review based on design rules, material selection, and process routing.

View Key Specs

Key Specs (Typical Range)

Fast feasibility check for common builds: layers, line/space, finished hole size and copper thickness.

: __ oz Max copper thicknessExample: up to 6 oz by project

: __ mm Min hole size (finished)Example: 0.20 mm typical

: _ / _ mil Min line / spaceExample: 4/4 mil typical

: __ Layers Max layer count (typical)Example: 2–12 layers typical

Common Build Options
Typical options we support for mainstream and industrial-grade projects.

Board thickness: __ mm to __ mm

Outer copper: __ oz to __ oz (heavier on request)

Solder mask: Green / Black / Blue / White (others on request)

Silkscreen: White (others on request)

Advanced Requirements (On Request)
For high-speed / high-reliability builds, engineering confirmation is required.

Controlled impedance (target & tolerance required)

Back drilling / signal integrity optimization

Blind / buried vias, via-in-pad (project-based)

Hard gold / edge connector requirements

Need capability confirmation for your design?

Upload Gerber and notes — engineering review included.

Upload Gerber Contact Engineering

Supported PCB Types

We manufacture a range of PCB structures for different performance and application requirements.

Product Scope

Rigid Board

SENLIAN manufactures durable, precision rigid PCBs that deliver dependable performance for mission-critical applications across all industries.

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HDI Boards

SENLIAN's HDI technology uses microvias and fine features to maximize density and signal speed in compact, high-performance electronics.

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Surface Finish & Process Options

Select the right finish and process set for assembly quality, reliability and lifecycle.

Surface Finish

Common finishes used for SMT assembly and reliability.

ENIG (Electroless Nickel Immersion Gold)
Lead-Free HASL
OSP
Hard Gold / Immersion Silver / Immersion Tin (on request)

Special Processes

Advanced options for high-speed and high-density builds […]

Advanced options for high-speed and high-density builds.

Controlled impedance (provide target & tolerance)
Back drilling
Blind / buried vias (on request)
Via-in-pad / edge connector requirements (project-based)

DFM & Engineering Review

We confirm manufacturability and suggest adjustments to improve yield and reliability.

Gerber Guide Stack-up Template

Quality Verification (At a Glance)

Quality checks depend on your build requirements and reliability targets.

Quality Overview AOI E-Test