Suitable for macro base stations, micro base stations, optical transceivers (10G/40G/100G) and communication main control boards, with features such as high-frequency stability, low electromagnetic interference, high isolation and high reliability. It can work stably in the temperature range of -40℃~85℃, resist strong electromagnetic interference in the communication environment, and ensure no signal loss, no frame loss and no distortion in high-speed data transmission; the circuit structure is stable, and long-term 24/7 operation without warping or delamination meets the high-reliability requirements of communication infrastructure.
Adopt high-frequency low-loss PCB materials (such as high-Tg FR-4, RF-4) to reduce signal attenuation and insertion loss; optimize multi-layer PCB layout, separate signal and power lines to minimize crosstalk; use gold-plated/immersion gold process to improve oxidation resistance and contact reliability, ensuring stable connection of high-frequency connectors; integrate input filtering, output isolation, over-current/over-voltage/over-temperature protection circuits to enhance safety; adopt high-efficiency heat dissipation design (such as high-thermal-conductivity copper clad laminate, heat sink matching) to reduce the working temperature of power devices and chips.
5G macro base station power supply and control modules use this circuit design to ensure stable operation of base stations under high load, support 1000+ concurrent users, and reduce signal drop rate by 90%; 100G optical transceivers rely on low-loss circuit layout to achieve ultra-long-distance transmission of 80km without signal attenuation, meeting the needs of long-haul communication; communication base station monitoring modules collect voltage, current and temperature data in real time, and quickly alarm faults to ensure uninterrupted communication; industrial communication gateways use high-reliability circuits to adapt to factory floor electromagnetic interference and realize seamless connection of field equipment and cloud platform.
High-frequency circuit processing has high requirements for precision, and the yield of fine line width (≤20μm) and micro-via processing is about 88-90%, which is lower than that of ordinary PCB; communication equipment has strict EMC (electromagnetic compatibility) certification requirements, and the certification cycle is long (about 3-6 months), increasing R&D and testing costs; long-term high-power operation leads to heat generation and aging of components, requiring regular maintenance and replacement; the market has high requirements for product consistency, and it is difficult to balance performance and cost for low-end products.
EN
